Solderless Breadboard - 740 Tie Points (ZY-W101)

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This small solderless breadboard is ideal for testing, prototyping, and experimentation. It features 270 tie points total: 230 tie-point prototyping area, plus two 20 tie-point strips suitable for ground and positive power. Embossed legend indicates columns and rows with numbers and letters. The tie points accept wires 21 to 26 AWG, or pins of 0.4 to 0.7mm diameter. ABS plastic construction with 4 mounting holes.

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